- Titulinis
- Dalykinė ir mokslinė literatūra
- TSV 3D RF Integration
TSV 3D RF Integration
ISBN: 9780323996020
Autorius : Yufeng Jin
Leidimo metai: 2022
Leidėjas: Elsevier
Leidinio kalba: Anglų
Formatas: Minkšti viršeliai
Formatas: 9.25×7.5
Autorius : Yufeng Jin
Leidimo metai: 2022
Leidėjas: Elsevier
Leidinio kalba: Anglų
Formatas: Minkšti viršeliai
Formatas: 9.25×7.5
Aprašymas
<p><i>TSV 3D RF Integration: High Resistivity Si Interposer Technology</i> systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. </p> <p>A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. </p>
Atsiliepimai (0)
Palikite atsiliepimą
